Thermal Ageing Effect on Electro-Mechanical Properties of Work Hardened High Conductive Copper Based Material

  • M Muzibur Rahman Military Institute of Science & Technology
  • S Reaz Ahmed Bangladesh University of Engineering & Technology
  • M Salim Kaiser Bangladesh University of Engineering & Technology
Keywords: Thermal Ageing, Work-hardening, Conductivity, Microhardness, Microstructure

Abstract

High conductive materials may undergo work hardening in the process of manufacturing and utilization as machine parts. Moreover, these materials face various thermal conditions at operational environment. As a consequence, the electro-mechanical properties of these materials get changed, which in turn affect their operational ability as these materials need to maintain high conductivity along with desirable mechanical properties. It gratifies to investigate the effect of thermal ageing on the electro-mechanical properties and microstructure of high conductive copper based material. In this work, the samples are prepared from copper ingot and alloy collected from local market. From the bulk material, long bars are taken, and they are at first homogenized and solution treated, and then they have been work hardened at different level in two conditions i.e., at room temperature and near recrystallization temperature. Thereafter, a series of experiments are carried out to determine the changes in conductivity, micro-hardness, strength, elongation and microstructure of samples as a function of thermal ageing temperature. Most of the mechanical properties after thermal ageing are found to be influenced quite significantly by work hardening.   

References

[1] Gain AK, Zhang L, Quadir MZ. Thermal ageing effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy, Elsevier, Materials and Design 110 (2016) pp. 275–283; doi.org/10.1016/ j.matdes.2016.08.007.
[2] Madeni JC, Liu S. Effect of Thermal Ageing on the Interfacial Reactions of Tin-Based Solder Alloys and Copper Substrates and Kinetics of Formation and Growth of Intermetallic Compounds, Soldag. insp. São Paulo, 16 (1) (2011) pp. 086-095.
[3] M. Sadiq, R. Pesci and M. Cherkaoui, Impact of Thermal Ageing on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders, Springer, Journal of Electronic Materials, 42 (3) (2013); DOI: 10.1007/ s11664-012-2351-8. [4] Çetinarslan CS. Effect of cold plastic deformation on electrical conductivity of various materials. Materials & Design, 30(3), (2009) pp.671–673. doi: 10.1016/j.matdes. 2008.05.035
[5] Kimura H, Inoue A, Sasamori K, Yoshida H, Haruyama O. Mechanical Properties and Electrical Conductivity of Heavily Cold-Rolled Cu100_xZrx Alloys (x ¼ 0{8}), Materials Transactions, The Japan Institute of Metals Vol. 46, No. 7 (2005). [6] Ivanov S, Markovich D, Stuparevich L, Guskovich D. Effect of degree of cold work and annealing temperature on the microstructure and properties of cold drawn copper wires and tubes. Bull. Mater. Sci. 19 (1), (1996) pp. 131–138. https://doi.org/ 10.1007/BF02744795
[7] Hatherly M, Malin S, Carmichael M, Humphrey J, Hirsch J. Deformation Processes in Hot Worked Copper and Brass, Acta metall. Vol. 34, No. 1 I, (1986) pp. 2247-2257.
[8] Rahman MM, Sufian MA, Shahid R, Kaiser MS, Ahmed SR. Effect of Hot and Cold Rolling on Electro-Mechanical Properties of a Commercial High-Conductive Metallic Material, 11th International Conference on Marine Technology MARTEC 2018 Proceedings, (2018) pp. 40-48.
[9] Raygana S, Mofradb HE, Pourabdoli M, Ahadi FK. Effect of rolling and annealing processes on the hardness and electrical conductivity values of Cu–13.5%Mn–4%Ni alloy, Journal of Materials Processing Technology 211 (2011).
[10] Davis JR, editor. Copper and Copper Alloys, ASM Specialty Handbook Series, ASM International, Materials Park, Ohio 44073-0002, USA, (2001).
[11] Malin AS, Hatherly M. Microstructure of cold-rolled copper, Metal Science, Volume 13, Issue 8, (1979).
[12] Thompson JG. Effect of cold-rolling on the indentation hardness of copper, Journal of Research of the Rational Bureau of Standards, Volume 13, (1934).
[13] Okayasu M, Muranaga T, Endo A. Analysis of microstructural effects on mechanical properties of copper Alloys, Journal of Science: Advanced Materials and Devices, Elsevier, (2017).
[14] Blatt FJ. Effect of Point Imperfections on the Electrical Properties of Copper I. Conductivity, Physical Review, 99 (6) (1955) 1708–1716. doi:10.1103/ physrev.99.1708.
[15] Mitchell TE, Thornton PR. The work-hardening characteristics of Cu and α-brass single crystals between 4•2 and 500°K, Philosophical Magazine, Cavendish Laboratory, Cambridge, 8 (91) (1963) 1127-1159, Published online: 2006; doi:10.1080/ 14786436308207340.
[16] Changa CC, Hsiao YS. Effect of Grain Size on Cross Wedge Rolling of Micro Copper Rod, Key Engineering Materials Vols. 622-623, (2014). https://doi.org/10.4028/www.scientific.net/KEM.622-623.905 [17] Chandler HD. Work hardening characteristics of copper from constant strain rate and stress relaxation testing, Materials Science and Engineering: A, 506, Issues 1–2, (2009), pp. 130-134. doi:10.1016/j.msea.2008.11.020
Published
2021-04-25
How to Cite
Rahman, M., Ahmed, S., & Kaiser, M. (2021, April 25). Thermal Ageing Effect on Electro-Mechanical Properties of Work Hardened High Conductive Copper Based Material. Sustainable Structures and Materials, An International Journal, 3(2), 13-22. https://doi.org/https://doi.org/10.26392/SSM.2020.03.02.013